Thin Film Metallization Stacks Serve as Reliable Conductors on Ceramic-based Substrates for Active Implants
P. Kiele, P. Cvancara, M. Langenmair, M. Mueller, T. Stieglitz
This paper develops a thin film metallization process for ceramic-based active implants that improves adhesion and reduces soldering time compared to traditional screen-printing methods.
bioRxiv · Jun 25, 2020Bioengineering